UAV
High Speed Interface
ESP32C3 SOC UART Board
- Min trace
- 4/4 mil
- Material
- Rogers 4350B
- Lead time
- 6 days
- Thickness
- 1.2 mm
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Precision PCB design.
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Translate your vision into robust, professional schematic design.
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Design for Manufacturing
Engineered for production tolerances and cost-optimized for long-term scalability.
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Board Catalog
7 boards available for fabrication
Wearable
High-Density Interconnect
ESP32S3 SOC Wearable Device v2
- Min trace
- 3/3 mil
- Material
- FR-4 TG170
- Lead time
- 5 days
- Thickness
- 1.6 mm
Wearable
High-Density Interconnect
ESP32S3 SOC Wearable Device
- Min trace
- 3/3 mil
- Material
- FR-4 TG170
- Lead time
- 5 days
- Thickness
- 1.6 mm
NFC / RFID
Mixed Signal RF Board
ESP32-S3R8 ST25R3916B Baseboard
- Min trace
- 3/3 mil
- Material
- FR-4 TG170
- Lead time
- 5 days
- Thickness
- 1.6 mm
UAV
High Power
Power Distribution Board
- Min trace
- 6/6 mil
- Material
- ENIG
- Lead time
- 4 days
- Thickness
- 1.6 mm
UAV
Breakout Board
RM3100 Breakout Board
- Min trace
- 5/5 mil
- Material
- FR-4 TG150
- Lead time
- 4 days
- Thickness
- 1.6 mm
UAV
High-Density Interconnect
Microcoaxial USB3.2 Cable
- Min trace
- 2.5/2.5 mil
- Material
- Megtron 6
- Lead time
- 9 days
- Thickness
- 0.8 mm