Design intent
A high-power distribution board for managing clean, repeatable power delivery across embedded systems and UAV platforms.
High Power
Power Distribution Board
A production-focused PCB design from Volteon SG, engineered for reliable performance and manufacturing readiness in Singapore.
- Layers
- 4 layer
- Material
- ENIG
- Min trace
- 6/6 mil
- Thickness
- 1.6 mm
- Lead time
- 4 days
Board documentation
Technical overview
Manufacturing notes
This 4-layer ENIG board uses a 6/6 mil minimum trace and space with a 1.6 mm finished thickness.
Integration guidance
Confirm current requirements, connector ratings, thermal conditions, fuse strategy, and clearance constraints before release.