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Power Distribution Board PCB design view 1

High Power

Power Distribution Board

A production-focused PCB design from Volteon SG, engineered for reliable performance and manufacturing readiness in Singapore.

Material
FR-4 TG135 ENIG
Thickness
1.6 mm
Lead time
5 days
Layers
4 layer

Board documentation

Technical overview

Board Description

A high-power distribution board for parallel power input.

Technical specifications

ENIG Surface Finish with edge plating for XT30 connector interface.

2oz copper weight.