Design intent
A high-density USB3.2 interconnect for compact, high-speed hardware where signal integrity and flexibility matter.
High-Density Interconnect
Microcoaxial USB3.2 Cable
A production-focused PCB design from Volteon SG, engineered for reliable performance and manufacturing readiness in Singapore.
- Layers
- 4 layer
- Material
- Megtron 6
- Min trace
- 2.5/2.5 mil
- Thickness
- 0.8 mm
- Lead time
- 9 days
Board documentation
Technical overview
Manufacturing notes
This 4-layer Megtron 6 design uses a 2.5/2.5 mil minimum trace and space with a 0.8 mm finished thickness.
Integration guidance
Validate cable routing, bend radius, connector retention, shielding, and high-speed signal integrity in the final assembly.