Design intent
An integrated ESP32-S3 platform for compact wearable and connected-device prototypes.
High-Density Interconnect
ESP32S3 SOC Wearable Device
A production-focused PCB design from Volteon SG, engineered for reliable performance and manufacturing readiness in Singapore.
- Layers
- 4 layer
- Material
- FR-4 TG170
- Min trace
- 3/3 mil
- Thickness
- 1.6 mm
- Lead time
- 5 days
Board documentation
Technical overview
Manufacturing notes
This 4-layer FR-4 TG170 board uses a 3/3 mil minimum trace and space with a 1.6 mm finished thickness.
Integration guidance
Review the enclosure, antenna, battery, connector, and sensor placement requirements before production release.