Back to portfolio
ESP32S3 Breakout PCB design view 1

Breakout Board

ESP32S3 Breakout

A production-focused PCB design from Volteon SG, engineered for reliable performance and manufacturing readiness in Singapore.

Material
FR-4 TG135 Leaded HASL
Thickness
1.6 mm
Lead time
14 days
Layers
4 layer
RF frequency
2.4 GHz

Board documentation

Technical overview

Board Description

Xiao ESP32-S3 Sense breakout board with battery management system and audio capability.

Technical specifications

Xiao ESP32-S3 Sense Stackable with 1.27mm header pins.

Implemented MAX98357A for audio amplification.

1S Li-po battery charging (TP4056) and I2C cell checking (MAX17048) implemented for battery management.